Samsung's semiconductor packaging and testing production line was officially put into operation on Tuesday afternoon in Xi'an, the capital of Shaanxi province, after one year's construction.
The project which is located in the city's high-tech industrial development zone was started to be built in January, 2014 and put into trial production in December, 2014. The production line mainly produces solid state drive (SSD) based on 3D vertical flash memory chips.
With the operation, Samsung (China) Co., Ltd. will become a semiconductor integrated production park of semiconductor memory chip production, packaging and testing in one, said Kim Kinam, general manager of Samsung's semiconductor division.
Samsung has a memory chip production base in South Korea and two memory chip packaging and testing centers in Korea and China's Suzhou city respectively, but Samsung (China) Semiconductor Co., Ltd. located in Xi'an High-tech Industrial Development Zone is, a nintegrated production park collecting the production, packaging and testing.
"After the completion and operation of Samsung Xi'an packaging and testing center, the 3D V-NAND flash memory produced by the previous preceding step will be made as solid-state drives (SSD) after packaging and testing processes," the Korean general manager said.
Samsung Electronics is the world top producer in the field of solid-state hard drive and its Xi'an production base for V-NAND flash-based solid-state drives will play very important role to further popularize its solid-state drives.
Samsung's high-level flash memory chip project with investment of $7 billion started to be built in Xi'an High-tech Industrial Development Zone on Sept 12, 2012 and was completed and put into operation on May 9, 2014, and the official operation of the semiconductor packaging and testing production line on Tuesday marked that Samsung's semiconductor complete production chain has been built in Xi'an high-tech zone, said An Jianli, director of the zone's administrative committee.
